A new patent submitted by Sony lets guess that the cooling system on the PlayStation 5 is going to be similar to the one on the Xbox. In other words, cooling that bets on a steam chamber. Did the Japanese manufacturer decide to be inspired by the American competitor because it considered that in fact it would be the right choice? It is not unreasonable.
Playstation 5 inspired by the XBOX cooling system?
The latest patent on the Sony heatsink describes a solution that is remarkably different from the current PS4 design and may include part of the PlayStation 5 cooling system. The patent describes a heatsink with internal conduction paths that allow heat pass directly from the SoC to the dissipation system. This ensures effective cooling without dramatically transforming the shape of the console.
The other half of the heatsink design is similar to that of the Xbox One X. Having said that, it has conductors that pass through holes in the PCB and connect to a thermal solution that is on the other side. The Xbox One X has a similar layout, with the heat sink on one side and the thermally regulated X on the other.
Below, we can see the Xbox One X heatsink removed from the console's PCB and exposing the conductors (dark green) and the holes through which they pass. Think of these conductors as a kind of secondary tubes for heat.
Heat flows from the chipset through the heat channels channeled to the fins of the heatsink and pushed by the system fans through the exhaust vents. However, there is no mention of any type of fan solution.
The current PlayStation 4 heatsink design lacks the conductors that connect to the other side of the PCB. Thus it is attached to the chipset through a kind of metal plate with thermal compound placed between it and the SoC.
In any case, PlayStation 5 architect Mark Cerny says fans will be very happy with the console's cooling solution and promises that a complete disassembly of the system will be launched soon.
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